High Precision Mounting Technology
Thick-film high precision pattern formation to align with Thin Film patterns
Aluminum wire bonding assures higher reliable connection between circuit board terminals and mounted semiconductor chips.
|Bonding Pitch||60μm min.|
|Supported Chip Size||2.0mm min.|
|Wire Material||Aluminum wire|
|Application in VFD||Driver chip mounting inside vacuum enclosure, Connections|
* Please inquire if you have higher requirements