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High Precision Mounting Technology

Thick-film high precision pattern formation to align with Thin Film patterns

Aluminum wire bonding assures higher reliable connection between circuit board terminals and mounted semiconductor chips.

Production specs at VFD manufacturing – Vacuum enclosure
Bonding Pitch	60μm min.
Supported Chip Size	2.0mm min.
Wire Material	Aluminum wire
Application in VFD	Driver chip mounting inside vacuum enclosure, Connections

* Please inquire if you have higher requirements

Thick Film Technology
Vacuum Technology
Core Technology