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High Precision Mounting Technology
Thick-film high precision pattern formation to align with Thin Film patterns
Aluminum wire bonding assures higher reliable connection between circuit board terminals and mounted semiconductor chips.
Bonding Pitch | 60μm min. |
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Supported Chip Size | 2.0mm min. |
Wire Material | Aluminum wire |
Application in VFD | Driver chip mounting inside vacuum enclosure, Connections |
* Please inquire if you have higher requirements