Core Technology Collaboration Service

High Precision Mounting Technology

Thick-film high precision pattern formation to align with Thin Film patterns

Aluminum wire bonding assures higher reliable connection between circuit board terminals and mounted semiconductor chips.

High Precision Mounting Technology

Production specs at VFD manufacturing – Vacuum enclosure
Bonding Pitch60μm min.
Supported Chip Size2.0mm min.
Wire MaterialAluminum wire
Application in VFDDriver chip mounting inside vacuum enclosure, Connections

* Please inquire if you have higher requirements